| Customer: ESA/ESTEC and Kayser-Italia (2005 – 2007) | |
 | Very large space structures need to be actively controlled during deployment, during maneuvers or during changing thermal environment. One possibility might be via Electro Active Polymers, which are metallized, silicone based thin sheets, which expand up to 10% once they are set under voltage. |
"Intelligent Material" can be classified in the following: Electro-active Polymers (EAPs), piezo-ceramic-based material and others like shape memory alloys or magneto-rheological material. This study focused on the first two classes and has been divided into three phases:
Phase I:
- establish the state of the art wrt intelligent materials and their maturity with respect to potential application in large spacecraft structures and appendages. This has been achieved through literature survey and material testing. A number of relevant material types and combinations has been be included.
- study the potential application of candidate intelligent materials for spacecraft structures, with emphasis on integrated vibration and shape control.
- Perform a detailed trade-off for the identified potential sensor/actuator systems, and elaborate a Development Plan, with the objective to mature and subsequent demonstrate the most promising sensor/actuator materials for space applications.
Phase II:
- implement the agreed material (actuator/sensor) Development Plan to mature the technology towards spacecraft applications. This will include detailed material/sensor/actuator developments and breadboard manufacturing and testing, where the breadboard constitutes a complete structurally integrated sensor/actuator system. A full characterization of the sensor/actuator under simulated ground and space conditions shall be performed on sensor/actuator level as well as on breadboard level.
Phase III:
- perform a dedicated spacecraft application study, based on the achieved sensor/actuator characteristics defined in Phase I and/or as developed in Phase II to demonstrate the benefit of the selected sensor/actuator combination.
This study has been lead by Kayser-Italia. HPS, as subcontractor, had the responsibility to identify the space applications as well as the development, manufacturing and assembly of the breadboards. Further Subcontractors are University of Rome (I), University of Pisa (I) and Risoe (DEN).
Publications:
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Statement of Work:
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