Customer: ESA/ESTEC (2008 - ongoing) |
| | Within the scope of this ESA project new ways of grounding with use of CFRP will be studied as follow-on activity of the “EMI-study”. |
Electrical grounding of space structures made from CFRP is not straight forward as two different tasks have to be fulfilled: providing a low impedance path for high frequency currents to fulfil the EMC requirements and to provide a low resistance path for fault currents. This is usually achieved with a network of flat grounding rails which covers the CFRP panels. Besides the impact on the mass – several kg on a large telecom satellite -- the grounding rails being situated underneath the satellite components is increasing the complexity and thus the costs of space projects. Enhancing the conductivity of the CFRP structure will allow to use the structure for the high frequency purposes just like in case with metal structures. Fault current handling however could be done by simple round wires which can be easily integrated in space structures.
Currently the test samples and breadboards are designed. The following tests are planned, linked mostly with respective numerical modelling: common mode impedance / EMC, fault current, pull-out (of conductive inserts), thermal.
Subcontractors to HPS are Astrium (F), MIRA (UK), Kayser-Threde (D), INVENT (D) and HPS-Portugal (PT).
